Simpson Strong-Tie hosted 32 Simpson Strong-Tie Student Scholarship Program award recipients from universities across the country as part of its new fellowship program. Students awarded the scholarship are incoming 2019–2020 juniors and seniors majoring in civil or structural engineering, architecture or construction management.

The Simpson Strong-Tie Fellowship is a three-day event in northern California providing participating students opportunities to network with industry professionals and fellow scholarship awardees, meet with Simpson Strong-Tie executives and tour the company’s headquarters along with its Tye Gilb Research Laboratory, the largest privately held structural engineering lab in the nation. They visit one of the company’s production facilities to view the manufacturing process and the cutting-edge technologies and robotics used to help make the company’s products. Students also participate in hands-on installations and demos using Simpson Strong-Tie products and visit a local jobsite so they can see the products in use.

“The ability to give our scholarship recipients a glimpse into our industry and company through the three-day fellowship program is a great privilege for us. Our goal for the fellowship is to provide real value in the form of networking and business knowledge to give them a leg up as they begin their careers in engineering, architecture, or construction management. I hope all of our scholarship winners take advantage of the fellowship as part of the Simpson Strong-Tie Student Scholarship Program,” said Simpson Strong-Tie COO Ricardo Arevalo.

Simpson Strong-Tie established the Student Scholarship Program in 1998. Since then, it has awarded more than 850 scholarships to students in nearly 100 participating universities, providing more than $1.2 million in support. As part of the Simpson Strong-Tie Student Scholarship Program, the company established the fellowship event in 2016 to provide awardees insight into the building industry as they progress into their professional careers.